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  tda2009a 10 +10w stereo amplifier september 2003 pin connection multiwatt11 ordering number : tda2009a ? . high output power (10 + 10w min. @ d = 1%) . high current capability (up to 3.5a) . ac short circuit protection . thermal overload protection . space and cost saving : very low number of external components and simple mounting thanks to the multiwatt package. description the tda2009a is class ab dual hi-fi audio power amplifier assembled in multiwatt package, spe- cially designed for high quality stereo application as hi-fi and music centers. 1/12
schematic diagram tda2009a 2/12
absolute maximum ratings symbol parameter value unit v s supply voltage 28 v i o output peak current (repetitive f 3 20 hz) 3.5 a i o output peak current (non repetitive, t = 100 m s) 4.5 a p tot power dissipation at t case = 90 c20w t stg, t j storage and junction temperature C 40, + 150 c thermal data symbol parameter value unit r th j-case thermal resistance junction-case max. 3 c/w electrical characteristics (refer to the stereo application circuit, t amb = 25 o c, v s = 24v, g v = 36db, unless otherwise specified) symbol parameter test conditions min. typ. max. unit v s supply voltage 8 28 v v o quiescent output voltage v s = 24v 11.5 v i d total quiescent drain current v s = 24v 60 120 ma p o output power (each channel) d = 1%, v s = 24v, f = 1khz r l = 4 w r l = 8 w f = 40hz to 12.5khz r l = 4 w r l = 8 w v s = 18v, f = 1khz r l = 4 w r l = 8 w 10 5 12.5 7 7 4 w w w w w w d distortion (each channel) f = 1khz, v s = 24v p o = 0.1 to 7w r l = 4 w p o = 0.1 to 3.5w r l = 8 w v s = 18v p o = 0.1 to 5w r l = 4 w p o = 0.1 to 2.5w r l = 8 w 0.2 0.1 0.2 0.1 % % % % ct cross talk (3) r l = , r g = 10k w f = 1khz f = 10khz 60 50 db v i input saturation voltage (rms) 300 mv r i input resistance f = 1khz, non inverting input 70 200 k w f l low frequency roll off (C 3db) r l = 4 w 20 hz f h high frequency roll off (C 3db) r l = 4 w 80 khz g v voltage gain (closed loop) f = 1khz 35.5 36 36.5 db d g v closed loop gain matching 0.5 db e n total input noise voltage r g = 10k w (1) r g = 10k w (2) 1.5 2.5 8 m v m v svr supply voltage rejection (each channel) r g = 10k w f ripple = 100hz, v ripple = 0.5v 55 db t j thermal shut-down junction temperature 145 c notes : 1. curve a 2. 22hz to 22khz tda2009a 3/12
figure 1 : test and application circuit (g v = 36db) figure 2 : p.c. board and component layout of the fig. 1 tda2009a 4/12
figure 3 : output power versus supply voltage figure 4 : output power versus supply voltage figure 5 : distortion versus output power figure 6 : distortion versus frequency figure 7 : distortion versus frequency figure 8 : quiescent current versus supply voltage tda2009a 5/12
figure 9 : supply voltage rejection versus frequency figure 10 : total power dissipation and efficiency versus output power figure 11 : total power dissipation and efficiency versus output power application information figure 12 : example of muting circuit tda2009a 6/12
figure 13 : 10w +10w stereo amplifier with tone balance and loudness control figure 14 : tone control response (circuit of figure 13) tda2009a 7/12
figure 15 : high quality 20 + 20w two way amplifier for stereo music center (one channel only) figure 16 : 18w bridge amplifier (d = 1%, g v = 40db) tda2009a 8/12
figure 17 : p.c. board and components layout of the circuit of figure 16 (1:1 scale) application suggestion the recommended values of the components are those shown on application circuit of fig. 1. different values can be used ; the following table can help the designer. component recommended value purpose larger than smaller than r1, r3 1.2k w close loop gain setting (1) increase of gain decrease of gain r2, r4 18k w decrease of gain increase of gain r5, r6 1 w frequency stability danger of oscillation at high frequency with inductive load c1, c2 2.2 m f input dc decoupling high turn-on delay high turn-on pop. higher low frequency cut-off. increase of noise c3 22 m f ripple rejection better svr. increase of the switch-on time degradation of svr c6, c7 220 m f feedback input dc decoupling c8, c9 0.1 m f frenquency stability danger of oscillation c10, c11 1000 m f to 2200 m f output dc decoupling higher low-frequency cut-off (1) the closed loop gain must be higher than 26db. the presence of a thermal limiting circuit offers the following advantages: 1) an averload on the output (even if it is permanent), or an excessive ambient temperature can be easily withstood. 2) the heatsink can have a smaller factor of safety compared with that of a conventional circuit. there is no device damage in the case of excessive junction temperature : all that happens is that p o (and therefore p tot ) and i o are reduced. the maximum allowable power dissipation de- pends upon the size of the external heatsink (i.e. its thermal resistance); figure 18 shows this dissi- pable power as a function of ambient temperature for different thermal resistance. short circuit (ac conditions). the tda2009a can withstand an accidental short circuit from the output and ground made by a wrong connection during normal play operation. build-in protection systems thermal shut-down tda2009a 9/12
the power dissipated in the circuit must be re- moved by adding an external heatsink. thanks to the multiwatt package attaching the heatsink is very simple, a screw or a compres- sion spring (clip) being sufficient. between the heatsink and the package it is better to insert a layer of silicon grease, to optimize the thermal contact ; no electrical isolation is needed between the two mounting instructions figure 18 : maximum allowable power dissipa- tion versus ambient temperature figure 19 : output power versus case temperature figure 20 : output power and drain current ver- sus case temperature tda2009a 10/12
multiwatt11 v dim. mm inch min. typ. max. min. typ. max. a 5 0.197 b 2.65 0.104 c 1.6 0.063 d 1 0.039 e 0.49 0.55 0.019 0.022 f 0.88 0.95 0.035 0.037 g 1.45 1.7 1.95 0.057 0.067 0.077 g1 16.75 17 17.25 0.659 0.669 0.679 h1 19.6 0.772 h2 20.2 0.795 l 21.9 22.2 22.5 0.862 0.874 0.886 l1 21.7 22.1 22.5 0.854 0.87 0.886 l2 17.4 18.1 0.685 0.713 l3 17.25 17.5 17.75 0.679 0.689 0.699 l4 10.3 10.7 10.9 0.406 0.421 0.429 l7 2.65 2.9 0.104 0.114 m 4.25 4.55 4.85 0.167 0.179 0.191 m1 4.73 5.08 5.43 0.186 0.200 0.214 s 1.9 2.6 0.075 0.102 s1 1.9 2.6 0.075 0.102 dia1 3.65 3.85 0.144 0.152 outline and mechanical data tda2009a 11/12
information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result f rom its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specificati ons mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or s ystems without express written approval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners ? 2003 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia C belgium - brazil - canada - china C czech republic - finland - france - germany - hong kong - india - israel - ital y - ja- pan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states www.st.com tda2009a 12/12


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